We are leading manufacturer of Electroplating intermediates for Nickel, Zinc and Cu platings in China. 1). Electroplating intermediates for Ni Plating: BBI, PME, BEO, TCA, PAP, BMP, PPS-OH, ATP, ATPN, BOZ, PPS ,PN, SSO3, PPS, POPDH, PS, DEP,TC-DEP, EHS,TC-EHS, ALS, PABS,
2).Electroplating intermediates for Zn Plating: IMZ, BPC, TC-BAR, MOME,BPE, OCBA,
3). Electroplating intermediates for Cu Plating: SPS,MPS, EDTP, JPH, DPS, UPS, ZPS.
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